In the electronics industry, molybdenum sputtering targets are widely used in flat panel displays, electrodes and thin film solar cells based on molybdenum’s high melting point, high conductivity, low specific impedance, good corrosion resistance and good environmental performance.
Compared with traditional iron, lead, cement and other shielding materials, the overall performance of tungsten alloy shields is superior. For example, under the same thickness and working environment, the shielding effect and service life of tungsten alloy shielding materials are better
Metal tungsten has the characteristics of high melting point, strong electron emission ability and low vapor pressure, making it the preferred thermionic emission material.
Ultra-fine cemented carbide is mainly made of ultra-fine tungsten carbide powder (WC) as the basic raw material, and is synthesized by adding appropriate binders and grain growth inhibitors.
Like TZM alloy (molybdenum-titanium-zirconium alloy) and MHC alloy (molybdenum-titanium-zirconium-carbon alloy), TZC alloy (molybdenum-titanium-zirconium-carbon alloy) is also a high-temperature-resistant molybdenum-based alloy, which is widely used in places with harsh working environments.