In the electronics industry, molybdenum sputtering targets are widely used in flat panel displays, electrodes and thin film solar cells based on molybdenum’s high melting point, high conductivity, low specific impedance, good corrosion resistance and good environmental performance.
With the development of modern electronic technology, the requirements for film-forming quality of semiconductor devices are getting higher and higher, thus promoting the progress of vacuum deposition technology, of which RF sputtering is a better film-forming method.
Molybdenum sputtering targets, ie molybdenum targets, are usually formed by sintering molybdenum powder. Molybdenum sputtering targets can form thin films on various substrates, and such sputtering films are widely used as electronic components and electronic products.
China has developed the first domestic G6 generation ultra-large size high-end molybdenum target with completely independent intellectual property rights, and achieved mass production in this quarter.