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Molybdenum Copper Heat Sink

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
  • FOTMA
  • 70MoCu Density: 9.8 g/cm3
  • 60MoCu Mo Content: 60±2%
  • 50MoCu Thermal conductivity : 250(25℃)/220(100℃)W/(M·K)
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Molybdenum Copper Heat Sink
Description:
  Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.
 
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Advantages:
  1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.
  2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.
 
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Product Properties:
Grade Mo Content Density g/cm3 Coefficient of thermal
Expansion ×10-6  (20℃)
Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 20025℃/196100℃
60MoCu 60±2% 9.66 7.5 22225℃/217100℃
50MoCu 50±2% 9.5 10.2 25025℃/220100℃
Molybdenum Copper Heat Sink

Application:
  Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.


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