Cu/MoCu/Cu (CPC) Heat Sink

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Brand: FOTMA
Density: 9.5 g/cm3
Coefficient of thermal Expansion ×10-6 (20℃): 7.3
Thermal conductivity W/(M·K): 280（XY）/170（Z）

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Product Description

Cu/MoCu/Cu (CPC) Heat Sink

Description:
Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.

Product Properties:

Grade	Density g/cm3	Coefficient of thermal Expansion ×10-6 (20℃)	Thermal conductivity W/(M·K)
CPC141	9.5	7.3	280（XY）/170（Z）

Application:
Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.