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Cu/MoCu/Cu (CPC) Heat Sink

Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
  • FOTMA
  • Density: 9.5 g/cm3
  • Coefficient of thermal Expansion ×10-6  (20℃): 7.3
  • Thermal conductivity W/(M·K): 280(XY)/170(Z)
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Cu/MoCu/Cu (CPC) Heat Sink

Description:
  Cu/MoCu/Cu(CPC) is a sandwich composite like Cu/Mo/Cu including a Mo-Cu alloy core layer and two copper clad layers.The ratio of the thickness in Cu:Mo-Cu:Cu can be varied. It has higher thermal conductivity than that of W(Mo)-Cu, Cu/Mo/Cu and is cheaper, so comparable speaking, it has higher price-quality ratio.
 
Cu/MoCu/Cu (CPC) Heat Sink

Product Properties:
Grade Density g/cm3 Coefficient of thermal
Expansion ×10-6  (20℃)
Thermal conductivity W/(M·K)
CPC141 9.5 7.3 280XY/170Z
 
Cu/MoCu/Cu (CPC) Heat Sink

Application:
  Cu/MoCu/Cu(CPC) can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
If you have interest about other composition of CPC like CPC232, CPC111, CPC300 and other contents, you can contact us free.


 
CPC.6(副本·)
CPC.5
CPC.4
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