Tungsten Copper Heat Sinks Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper's thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.
Tungsten copper sheets have very high in plane conductivity provide by layers of copper and low thermal expansion provided by the inner layer of molybdenum. These laminated sheets have the ability to spread the heat from a concentrated heat source and then dissipate the heat through the layers. They Also:
Offer an economical solution to many applications
Will not delaminate and can resist repeated 850' C cycles
Available in several standard ratios and many thicknesses for tailored TE machining
Are lower weight than WCu composite materials
Are available in larger and thinner sheet size
Utilize copper that is easily plated
Can be machined by EDM
WCu composites are made by infiltrating, under vacuum, uniform controlled porous blocks of tungsten with molten co pper. This results in a material with an interconnected copper matrix that has high thermal conductivity in all axis, low thermal expansion, and good electrical conductivity, Copper content can range between 10% and 25%.
Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
The CuW75 tungsten copper alloy is used extensively in thermal mounting plates, chip carriers,
