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Cu/Mo/Cu(CMC) Heat Sink

Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.
  • FOTMA
  • Material: S-CMC
  • Density: 9.32 g/cm3
  • CMC11Coefficient of thermal Expansion ×10-6  (20℃): 8.8
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Cu/Mo/Cu(CMC) Heat Sink
 
Description:
  Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

  S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.
 
Cu/Mo/Cu(CMC) Heat Sink

Product Properties:
Grade Density g/cm3 Coefficient of thermal
Expansion ×10-6  (20℃)
Thermal conductivity W/(M·K)
CMC111 9.32 8.8 305XY/250Z
CMC121 9.54 7.8 260XY/210Z
CMC131 9.66 6.8 244XY/190Z
CMC141 9.75 6 220XY/180Z
CMC13/74/13 9.88 5.6 200XY/170Z

Material Wt%
Molybdenum Content
g/cm3
Density
Thermal conductivity at 25℃ Coefficient of thermal
expansion at 25℃
S-CMC 5 9.0 362 14.8
10 9.0 335 11.8
13.3 9.1 320 10.9
20 9.2 291 7.4

Cu/Mo/Cu(CMC) Heat Sink 

Application:
  Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
  S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.

Cu/Mo/Cu(CMC) Heat Sink 


CMC.5

CMC.6
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