Cu/Mo/Cu(CMC) Heat Sink

Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

Brand:
FOTMA
Material: S-CMC
Density: 9.32 g/cm3
CMC11Coefficient of thermal Expansion ×10-6 (20℃): 8.8

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Product Description

Cu/Mo/Cu(CMC) Heat Sink

Description:
Cu/Mo/Cu(CMC) heat sink, also known as CMC alloy, is a sandwich structured and flat-panel composite material. It uses pure molybdenum as the core material, and is covered with pure copper or dispersion strengthened copper on both sides. Besides, copper molybdenum copper heat sink has adjustable coefficient of thermal expansion, high thermal conductivity, and high thermal stability.

S-CMC is a multi-layered Copper and Molybdenum clad metal, which has an excellent property both low CTE and high thermal conductivity. Its higher thermal conductivity compared to other same kind of materials contributes to highly powered electronic packages.

Product Properties:

Grade	Density g/cm3	Coefficient of thermal Expansion ×10-6 (20℃)	Thermal conductivity W/(M·K)
CMC111	9.32	8.8	305（XY）/250（Z）
CMC121	9.54	7.8	260（XY）/210（Z）
CMC131	9.66	6.8	244（XY）/190（Z）
CMC141	9.75	6	220（XY）/180（Z）
CMC13/74/13	9.88	5.6	200（XY）/170（Z）

Material	Wt% Molybdenum Content	g/cm3 Density	Thermal conductivity at 25℃	Coefficient of thermal expansion at 25℃
S-CMC	5	9.0	362	14.8
	10	9.0	335	11.8
	13.3	9.1	320	10.9
	20	9.2	291	7.4

Application:
Cu/Mo/Cu(CMC) heat sink has similar applications with tungsten copper heat sinks. It can be used as thermal mounting plates, chip carriers for microwave, flanges and frames for RF, laser diode packages, LED packages, BGA packages and GaAs device mounts etc.
S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.