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Uses of Tungsten Alloy Wafers

Views:2     Author:Site Editor     Publish Time: 2020-09-03      Origin:Site

Uses of Tungsten Alloy Wafers

Tungsten alloy is an alloy composed of tungsten and other elements. Tungsten alloy wafers are made of tungsten molybdenum alloy or tungsten thorium alloy or rare earth tungsten alloy or tungsten rhenium alloy. They are often used as power semiconductor devices and electric vacuum devices. The substrate in the medium is easy to process and has better performance than the molybdenum wafer.


According to the material, it can be divided into cemented carbide, high specific gravity alloy, metal sweating material, contact material, electronic and electric light source materials, etc. It has high density, high hardness, high strength, high melting point and excellent properties such as heat conduction, electrical conductivity and electron emission. It is widely used in aerospace, aviation, military, petroleum drilling, electrical instruments, medicine and other industries.


Some examples of the uses of tungsten alloy wafers in the machinery industry are as follows:


1. It can process ion implantation parts, manufacture electric light source and electric vacuum parts, produce cover plate in sapphire crystal growth furnace, heating zone and connector in vacuum furnace, sputtering target for plasma coating, evaporation tungsten boat, etc. Products.


2. It is suitable for manufacturing cast iron rolls and high-nickel-chromium roll trimming knives.


3. It is suitable for manufacturing unloading plates, stamping dies, punches, electronic progressive dies and other stamping dies.


4. It can be used as a tungsten steel bushing.


5. Manufacturing wear-resistant parts.


6. It is suitable for processing fiberboard and density board with higher density.


7. High cost performance.


In addition, cemented carbide wafers are mostly used for cutting hard materials such as copper and stainless steel. The solid carbide disc knife is suitable for ordinary steel, alloy steel, quenched steel, copper, aluminum, stainless steel, titanium alloy and other metal materials and electronic printed circuit boards, cement asbestos tiles, wall and floor tiles, paper, adhesive tape, rubber, Cutting or grooving of non-metallic materials such as leather.



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