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Type B Boron Nitride Ceramics

The material has high density, low coefficient of thermal expansion, and good thermal conductivity. It is especially suitable for the use of semiconductor, microelectronics and other equipment parts.
Quantity:
  • B
  • FOTMA
  • B
  • 2.15g/cm³
  • 95Mpa
Type B Boron  Nitride  Ceramics

Product main performance parameters
Grade B
Chemical structure 99%
Other components No
Density 2.15g/cm⊃3;
Hardness 450HL
Flexural Strength 95Mpa
Coefficient of thermal expansion 1~210^-6/K)
Thermal conductivity at 20℃ 35W/mk
MAX-Temperature of use Oxidizing 900℃
Vacuum 1600℃
Inert 1800℃
RT Resistivity Ω.cm 10^14

B.5    B型氮化硼陶瓷制品.2
Product features and advantages
  Adopting the international advanced hot pressing sintering process, without adding any sintering aids, the material has high purity and good stability.
  The material has high density, low coefficient of thermal expansion, and good thermal conductivity. It is especially suitable for the use of semiconductor, microelectronics and other equipment parts.
  Excellent machining performance, precision machining to 0.02mm accuracy, it is the best choice for precision ceramic parts.
B型氮化硼陶瓷制品.3
 
Typical application:
  Boron Nitride Spare Parts for Ion Implantation Equipment
  Boron nitride insulating gaskets and seals for high temperature equipment
  Boron nitride parts for vacuum coating equipment (replacement of alumina)
  Powder metallurgy atomization nozzle

                                                       B型氮化硼陶瓷制品.6


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