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Molybdenum Copper Heat Sink |
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| Introduce(detail): Molybdenum Copper high performance composites are fabricated from carefully controlled porous Molybdenum that is vacuum infiltrated with molten copper. This results in a MoCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
It is a composite of molybdenum and copper. By controlling the content of molybdenum, we can design its coefficient of thermal expansion (CTE), matching that of the materials, such as Ceramics (Al2O3, BeO), Semiconductors (Si), Kovar, etc.
Advantages: High thermal conductivity, Excellent hermeticity, Excellent size control, surface finish and flatness, Semi-finished or finished (Ni/Au plated) products available
properties of WCu and MoCu heat materials
 Our molybdenum copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of molybdenum, molybdenum copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make molybdenum copper alloy an excellent choice even for extremely dense circuits.
The molybdenum copper alloy is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a molybdenum copper material, it's a composite, so both the thermal advantages of copper and the very low expansion characteristics of molybdenum can be utilized.
The combination of molybdenum & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of molybdenum copper's thermal conductivity and expansion characteristics, Molybdenum copper alloy works well in densely packed circuits. |
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| More Related Subjects: Molybdenum's Long Term Potential |